International Wafer Level Packaging Conference 2026 | Fremont Marriott Silicon Valley
Conferences
International Wafer Level Packaging Conference brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies. The International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. The conference has a rich history of bringing together attendees from over 16 countries in the heart of Silicon Valley to immerse themselves in the latest technology and business trends.
Information Source: Surface Mount Technology Association (SMTA) | expotobi